MAX15022EVKIT+【PDF 24/28 页】KIT EVAL FOR MAX15022

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Dual, 4A/2A, 4MHz, Step-Down DC-DC

Regulator with Dual LDO Controllers

Minimum Load Requirements

(Linear Regulators)

Under no-load conditions, leakage currents from the

pass transistors supply the output capacitor, even

when the transistor is off. Generally, this is not a prob-

lem since the feedback resistors’ current drains the

excess charge. However, charge can build up on the

output capacitor over temperature, making output volt-

age rise above its set point. Care must be taken to

ensure the feedback resistors ’ current exceeds the

pass transistor’s leakage current over the entire tem-

perature range.

Thermal Consideration

The power dissipated by the pass transistor is calculat-

ed by:

P P3/4 = ( V IN ? V OUT3/4 ) × I OUT3/4

where V IN is the input to the transistor of the LDO.

Heatsink the transistor adequately to prevent a thermal

runaway condition. Refer to the transistor data sheet for

thermal calculations.

Applications Information

PCB Layout Guidelines

Careful PCB layout is critical to achieve clean and sta-

ble operation. Follow these guidelines for good PCB

layout:

1) Place decoupling capacitors as close as possible to

the IC pins.

2) Keep SGND and PGND isolated. Connect them at

one single point typically close to the negative ter-

minal of the input filter capacitor. Use as short a

trace as possible.

3) Route high-speed switching nodes (LX_) away from

sensitive analog areas (FB_, COMP_, B_, and EN_).

4) Distribute the power components evenly across the

board for proper heat dissipation.

5) Ensure all feedback connections are short and

direct. Place feedback resistors as close as possi-

ble to the IC.

6) Place the output capacitors close to the load.

7) Connect the MAX15022 exposed pad to a large

copper plane to maximize its power dissipation

capability. Thermal resistances can be obtained

using the method described in JEDEC specification

JESD51-7. Connect the exposed pad to SGND

plane. Do not connect the exposed pad to the

SGND pin directly underneath the IC.

8) Use 2oz. copper to keep trace inductance and

resistance to a minimum. Thin copper PCBs can

compromise efficiency since high currents are

involved in the application. Also thicker copper con-

ducts heat more effectively, thereby reducing ther-

mal impedance.

9) A reference PCB layout included in the MAX15022

Evaluation Kit is also provided to further aid layout.

24

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